IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-0634-G-T

APH-0634-G-T

APH-0634-G-T

Samtec Inc.

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RFQ

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116-43-650-61-008000

116-43-650-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

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RFQ

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116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-650-61-008000

116-93-650-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

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RFQ

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116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-668-61-005000

117-93-668-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

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RFQ

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117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-952-61-003000

116-43-952-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

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RFQ

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116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-952-61-003000

116-93-952-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-87-321-17-101147

546-87-321-17-101147

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
RFQ
546-87-321-17-101147

데이터시트

546 Bulk Active PGA 321 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-321-19-121147

546-87-321-19-121147

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
RFQ
546-87-321-19-121147

데이터시트

546 Bulk Active PGA 321 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0526-G-H

APH-0526-G-H

APH-0526-G-H

Samtec Inc.

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RFQ

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APH-1926-G-H

APH-1926-G-H

APH-1926-G-H

Samtec Inc.

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RFQ

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APH-1526-G-H

APH-1526-G-H

APH-1526-G-H

Samtec Inc.

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RFQ

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APH-0826-G-H

APH-0826-G-H

APH-0826-G-H

Samtec Inc.

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RFQ

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APH-1826-G-H

APH-1826-G-H

APH-1826-G-H

Samtec Inc.

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RFQ

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APH-1326-G-H

APH-1326-G-H

APH-1326-G-H

Samtec Inc.

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RFQ

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APH-1226-G-H

APH-1226-G-H

APH-1226-G-H

Samtec Inc.

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RFQ

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APH-0226-G-H

APH-0226-G-H

APH-0226-G-H

Samtec Inc.

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RFQ

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APH-0326-G-H

APH-0326-G-H

APH-0326-G-H

Samtec Inc.

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RFQ

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517-83-419-19-111111

517-83-419-19-111111

CONN SOCKET PGA 419POS GOLD

Preci-Dip

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RFQ
517-83-419-19-111111

데이터시트

517 Bulk Active PGA 419 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
48-6556-31

48-6556-31

UNIV TEST SOCKET RECEPT 6556

Aries Electronics

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RFQ

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6556 - Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled 150°C
24-6556-40

24-6556-40

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-6556-40

데이터시트

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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