IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
35-0511-11

35-0511-11

CONN SOCKET SIP 35POS GOLD

Aries Electronics

0 -
RFQ
35-0511-11

데이터시트

511 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
123-91-950-41-001000

123-91-950-41-001000

SOCKET IC OPEN 3 LVL .900 50POS

Mill-Max Manufacturing Corp.

0 -
RFQ

-

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-41-950-41-001000

123-41-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
123-41-950-41-001000

데이터시트

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-320-G-B

APA-320-G-B

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-320-G-B

데이터시트

APA Bulk Active - 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-320-G-B

APO-320-G-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-320-G-B

데이터시트

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
110-93-648-61-001000

110-93-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-320-61-605000

110-93-320-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-952-41-008000

116-93-952-41-008000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-952-41-008000

데이터시트

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-952-41-008000

116-43-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-952-41-008000

데이터시트

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-964-41-008000

116-41-964-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-41-964-41-008000

데이터시트

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-964-41-008000

116-91-964-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-91-964-41-008000

데이터시트

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-244-31-018000

714-43-244-31-018000

CONN IC DIP SOCKET 44POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
714-43-244-31-018000

데이터시트

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-964-41-001000

614-41-964-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-41-964-41-001000

데이터시트

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-964-41-001000

614-91-964-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-91-964-41-001000

데이터시트

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-83-441-21-000101

510-83-441-21-000101

CONN SOCKET PGA 441POS GOLD

Preci-Dip

0 -
RFQ
510-83-441-21-000101

데이터시트

510 Bulk Active PGA 441 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-3508-211

28-3508-211

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
RFQ
28-3508-211

데이터시트

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
517-83-320-19-131111

517-83-320-19-131111

CONN SOCKET PGA 320POS GOLD

Preci-Dip

0 -
RFQ
517-83-320-19-131111

데이터시트

517 Bulk Active PGA 320 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-640-JGG

ICO-640-JGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-640-JGG

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
411-13-264-41-001000

411-13-264-41-001000

SOCKET DUAL IN-LINE SLDRTL 64POS

Mill-Max Manufacturing Corp.

0 -
RFQ
411-13-264-41-001000

데이터시트

411 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-210-61-001000

116-93-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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