IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
123-93-632-41-801000

123-93-632-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
123-93-632-41-801000

데이터시트

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-11-642-41-001000

122-11-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
122-11-642-41-001000

데이터시트

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-210-61-001000

115-93-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

115 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1916-G-T

APH-1916-G-T

APH-1916-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1416-G-T

APH-1416-G-T

APH-1416-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0516-G-T

APH-0516-G-T

APH-0516-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1516-G-T

APH-1516-G-T

APH-1516-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0616-G-T

APH-0616-G-T

APH-0616-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0216-G-T

APH-0216-G-T

APH-0216-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0816-G-T

APH-0816-G-T

APH-0816-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1616-G-T

APH-1616-G-T

APH-1616-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
110-44-420-61-001000

110-44-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-952-41-008000

116-41-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-41-952-41-008000

데이터시트

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-952-41-008000

116-91-952-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-91-952-41-008000

데이터시트

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-640-41-001000

612-11-640-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-11-640-41-001000

데이터시트

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-44-314-61-003000

115-44-314-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
550-10-121-13-061101

550-10-121-13-061101

PGA SOLDER TAIL

Preci-Dip

0 -
RFQ
550-10-121-13-061101

데이터시트

550 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0315-G-12

HLS-0315-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0315-G-12

데이터시트

HLS Tube Active SIP 45 (3 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
514-87-223-18-091117

514-87-223-18-091117

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
RFQ
514-87-223-18-091117

데이터시트

514 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
36-0501-21

36-0501-21

CONN SOCKET SIP 36POS GOLD

Aries Electronics

0 -
RFQ
36-0501-21

데이터시트

501 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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