IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
612-11-632-41-001000

612-11-632-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-11-632-41-001000

데이터시트

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-422-G-C

APO-422-G-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-422-G-C

데이터시트

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
514-87-321-19-121154

514-87-321-19-121154

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
RFQ
514-87-321-19-121154

데이터시트

514 Bulk Active PGA 321 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-41-650-31-018000

614-41-650-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-41-650-31-018000

데이터시트

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-650-31-018000

614-91-650-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-91-650-31-018000

데이터시트

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0918-G-H

APH-0918-G-H

APH-0918-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1418-G-H

APH-1418-G-H

APH-1418-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1918-G-H

APH-1918-G-H

APH-1918-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0518-G-H

APH-0518-G-H

APH-0518-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0618-G-H

APH-0618-G-H

APH-0618-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1118-G-H

APH-1118-G-H

APH-1118-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1618-G-H

APH-1618-G-H

APH-1618-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1218-G-H

APH-1218-G-H

APH-1218-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1318-G-H

APH-1318-G-H

APH-1318-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0418-G-H

APH-0418-G-H

APH-0418-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0318-G-H

APH-0318-G-H

APH-0318-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
116-47-648-41-001000

116-47-648-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-47-648-41-001000

데이터시트

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
321-13-132-41-001000

321-13-132-41-001000

SOCKET 1 LEVEL WRAPOST SIP 32POS

Mill-Max Manufacturing Corp.

0 -
RFQ
321-13-132-41-001000

데이터시트

321 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-950-31-012000

614-41-950-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-41-950-31-012000

데이터시트

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-950-31-012000

614-91-950-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-91-950-31-012000

데이터시트

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Total 19086 Record«Prev1... 731732733734735736737738...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자