IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
614-87-145-15-081112

614-87-145-15-081112

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
RFQ
614-87-145-15-081112

데이터시트

614 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
126-41-642-41-001000

126-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-41-642-41-001000

데이터시트

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-642-41-001000

126-91-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-91-642-41-001000

데이터시트

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-952-41-006000

116-41-952-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-41-952-41-006000

데이터시트

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-952-41-006000

116-91-952-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-91-952-41-006000

데이터시트

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0510-T-10

HLS-0510-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0510-T-10

데이터시트

HLS Bulk Active SIP 50 (5 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
104-11-636-41-780000

104-11-636-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
104-11-636-41-780000

데이터시트

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-432-41-001000

614-93-432-41-001000

SOCKET CARRIER LOWPRO .400 32POS

Mill-Max Manufacturing Corp.

0 -
RFQ
614-93-432-41-001000

데이터시트

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-632-41-001000

614-93-632-41-001000

SOCKET CARRIER LOWPRO .600 32POS

Mill-Max Manufacturing Corp.

0 -
RFQ
614-93-632-41-001000

데이터시트

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-432-41-001000

614-43-432-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-43-432-41-001000

데이터시트

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-632-41-001000

614-43-632-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-43-632-41-001000

데이터시트

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-87-182-14-001135

546-87-182-14-001135

CONN SOCKET PGA 182POS GOLD

Preci-Dip

0 -
RFQ
546-87-182-14-001135

데이터시트

546 Bulk Active PGA 182 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-182-14-001136

546-87-182-14-001136

CONN SOCKET PGA 182POS GOLD

Preci-Dip

0 -
RFQ
546-87-182-14-001136

데이터시트

546 Bulk Active PGA 182 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-91-642-41-001000

123-91-642-41-001000

SOCKET IC OPEN 3 LVL .600 42POS

Mill-Max Manufacturing Corp.

0 -
RFQ

-

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-41-642-41-001000

123-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
123-41-642-41-001000

데이터시트

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-6621-30

32-6621-30

CONN IC DIP SOCKET 32POS TIN

Aries Electronics

0 -
RFQ
32-6621-30

데이터시트

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
712-93-132-41-001000

712-93-132-41-001000

SOCKET CARRIER SIP 32POS

Mill-Max Manufacturing Corp.

0 -
RFQ
712-93-132-41-001000

데이터시트

712 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
514-83-144-12-000117

514-83-144-12-000117

CONN SOCKET PGA 144POS GOLD

Preci-Dip

0 -
RFQ
514-83-144-12-000117

데이터시트

514 Bulk Active PGA 144 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
25-0503-21

25-0503-21

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
RFQ
25-0503-21

데이터시트

0503 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
18-3508-211

18-3508-211

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
RFQ
18-3508-211

데이터시트

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 698699700701702703704705...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자