IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
ICS-640-T

ICS-640-T

IC SOCKET, DIP, 40P 2.54MM PITCH

Adam Tech

5,036 -
RFQ
ICS-640-T

데이터시트

ICS Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
ED16DT

ED16DT

CONN IC DIP SOCKET 16POS TIN

On Shore Technology Inc.

4,120 -
RFQ
ED16DT

데이터시트

ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
DILB24P-223TLF

DILB24P-223TLF

CONN IC DIP SOCKET 24POS TINLEAD

Amphenol ICC (FCI)

6,814 -
RFQ
DILB24P-223TLF

데이터시트

DILB Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
ED20DT

ED20DT

CONN IC DIP SOCKET 20POS TIN

On Shore Technology Inc.

15,136 -
RFQ
ED20DT

데이터시트

ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
243-20-1-03

243-20-1-03

CONN IC DIP SOCKET 20POS TIN

CNC Tech

7,380 -
RFQ
243-20-1-03

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
245-16-1-03

245-16-1-03

CONN IC DIP SOCKET 16POS TIN

CNC Tech

5,485 -
RFQ
245-16-1-03

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
DILB14P-223TLF

DILB14P-223TLF

CONN IC DIP SOCKET 14POS TIN

Amphenol ICC (FCI)

1,295 -
RFQ
DILB14P-223TLF

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
D01-9970342

D01-9970342

CONN SOCKET SIP 3POS GOLD

Harwin Inc.

9,747 -
RFQ
D01-9970342

데이터시트

D01-997 Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-306-41-001101

110-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

6,785 -
RFQ
110-87-306-41-001101

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A 24-LC-TT

A 24-LC-TT

CONN IC DIP SOCKET 24POS TIN

Assmann WSW Components

1,965 -
RFQ
A 24-LC-TT

데이터시트

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
245-18-1-03

245-18-1-03

CONN IC DIP SOCKET 18POS TIN

CNC Tech

1,776 -
RFQ
245-18-1-03

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
DILB20P-223TLF

DILB20P-223TLF

CONN IC DIP SOCKET 20POS TIN

Amphenol ICC (FCI)

10,824 -
RFQ
DILB20P-223TLF

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
DILB32P-223TLF

DILB32P-223TLF

CONN IC DIP SOCKET 32POS TINLEAD

Amphenol ICC (FCI)

6,231 -
RFQ
DILB32P-223TLF

데이터시트

DILB Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
SA083000

SA083000

CONN IC DIP SOCKET 8POS GOLD

On Shore Technology Inc.

4,096 -
RFQ
SA083000

데이터시트

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
AR 06-HZL/01-TT

AR 06-HZL/01-TT

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components

20,223 -
RFQ
AR 06-HZL/01-TT

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
ICM-308-1-GT-HT

ICM-308-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 8P

Adam Tech

2,929 -
RFQ
ICM-308-1-GT-HT

데이터시트

ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
A 28-LC-TT

A 28-LC-TT

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

1,565 -
RFQ
A 28-LC-TT

데이터시트

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
A 20-LC-TT

A 20-LC-TT

CONN IC DIP SOCKET 20POS TIN

Assmann WSW Components

1,487 -
RFQ
A 20-LC-TT

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
245-20-1-03

245-20-1-03

CONN IC DIP SOCKET 20POS TIN

CNC Tech

1,216 -
RFQ
245-20-1-03

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
210-1-06-003

210-1-06-003

CONN IC DIP SOCKET 6POS GOLD

CNC Tech

7,529 -
RFQ
210-1-06-003

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
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