IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
517-87-325-18-111111

517-87-325-18-111111

CONN SOCKET PGA 325POS GOLD

Preci-Dip

0 -
RFQ
517-87-325-18-111111

데이터시트

517 Bulk Active PGA 325 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
111-93-642-41-001000

111-93-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
111-93-642-41-001000

데이터시트

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-43-642-41-001000

111-43-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
111-43-642-41-001000

데이터시트

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
27-0501-31

27-0501-31

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
RFQ
27-0501-31

데이터시트

501 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
36-0501-20

36-0501-20

CONN SOCKET SIP 36POS TIN

Aries Electronics

0 -
RFQ
36-0501-20

데이터시트

501 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
123-93-424-41-001000

123-93-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
123-93-424-41-001000

데이터시트

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
26-7590-10

26-7590-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

0 -
RFQ
26-7590-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
26-7650-10

26-7650-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

0 -
RFQ
26-7650-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-0934-T-H

APH-0934-T-H

APH-0934-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1434-T-H

APH-1434-T-H

APH-1434-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0634-T-H

APH-0634-T-H

APH-0634-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1334-T-H

APH-1334-T-H

APH-1334-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0334-T-H

APH-0334-T-H

APH-0334-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1634-T-H

APH-1634-T-H

APH-1634-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0834-T-H

APH-0834-T-H

APH-0834-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0734-T-H

APH-0734-T-H

APH-0734-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0234-T-H

APH-0234-T-H

APH-0234-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
116-93-432-41-006000

116-93-432-41-006000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-432-41-006000

데이터시트

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-632-41-006000

116-93-632-41-006000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-632-41-006000

데이터시트

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-432-41-006000

116-43-432-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-432-41-006000

데이터시트

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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