IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
612-91-318-41-003000

612-91-318-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-91-318-41-003000

데이터시트

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-147-31-018000

714-43-147-31-018000

CONN SOCKET SIP 47POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
714-43-147-31-018000

데이터시트

714 Bulk Active SIP 47 (1 x 47) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-99-132-41-012000

346-99-132-41-012000

SOCKET SLDRLSS PRESSFIT SIP32POS

Mill-Max Manufacturing Corp.

0 -
RFQ
346-99-132-41-012000

데이터시트

346 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-318-41-770000

104-13-318-41-770000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
104-13-318-41-770000

데이터시트

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
517-87-304-14-051111

517-87-304-14-051111

CONN SOCKET PGA 304POS GOLD

Preci-Dip

0 -
RFQ
517-87-304-14-051111

데이터시트

517 Bulk Active PGA 304 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-632-AGG

ICA-632-AGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-632-AGG

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0314-T-12

HLS-0314-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0314-T-12

데이터시트

HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
110-47-648-41-105000

110-47-648-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-47-648-41-105000

데이터시트

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0430-T-H

APH-0430-T-H

APH-0430-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0930-T-H

APH-0930-T-H

APH-0930-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1430-T-H

APH-1430-T-H

APH-1430-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1030-T-H

APH-1030-T-H

APH-1030-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0630-T-H

APH-0630-T-H

APH-0630-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0830-T-H

APH-0830-T-H

APH-0830-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0730-T-H

APH-0730-T-H

APH-0730-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0230-T-H

APH-0230-T-H

APH-0230-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0330-T-H

APH-0330-T-H

APH-0330-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
116-47-636-41-006000

116-47-636-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-47-636-41-006000

데이터시트

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-324-31-012000

614-41-324-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-41-324-31-012000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-424-31-012000

614-41-424-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-41-424-31-012000

데이터시트

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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