IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
28-3553-10

28-3553-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

0 -
RFQ
28-3553-10

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-6552-10

28-6552-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

0 -
RFQ
28-6552-10

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
317-93-120-41-005000

317-93-120-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
RFQ
317-93-120-41-005000

데이터시트

317 Tube Active SIP 20 (1 x 20) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-316-41-003000

116-93-316-41-003000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-316-41-003000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-316-41-003000

116-43-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-316-41-003000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-314-G-Q

APA-314-G-Q

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-314-G-Q

데이터시트

APA Tube Active - 14 (2 x 7) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
116-93-314-41-008000

116-93-314-41-008000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-314-41-008000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-314-41-008000

116-43-314-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-314-41-008000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-93-117-41-005000

317-93-117-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
RFQ
317-93-117-41-005000

데이터시트

317 Tube Active SIP 17 (1 x 17) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-47-642-41-001000

111-47-642-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
RFQ
111-47-642-41-001000

데이터시트

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-41-314-41-001000

612-41-314-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-41-314-41-001000

데이터시트

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-314-41-001000

612-91-314-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-91-314-41-001000

데이터시트

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-41-628-41-005000

117-41-628-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
117-41-628-41-005000

데이터시트

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-91-628-41-005000

117-91-628-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
117-91-628-41-005000

데이터시트

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-432-41-105000

110-41-432-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-41-432-41-105000

데이터시트

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-432-41-105000

110-91-432-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-91-432-41-105000

데이터시트

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0407-T-10

HLS-0407-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0407-T-10

데이터시트

HLS Bulk Active SIP 28 (4 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
123-13-306-41-001000

123-13-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
123-13-306-41-001000

데이터시트

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-13-318-41-001000

210-13-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
210-13-318-41-001000

데이터시트

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-91-636-41-003000

115-91-636-41-003000

SOCKET IC OPEN LOWPRO .600 36POS

Mill-Max Manufacturing Corp.

0 -
RFQ

-

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
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