IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1226-T-R

APH-1226-T-R

APH-1226-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0728-T-T

APH-0728-T-T

APH-0728-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0328-T-T

APH-0328-T-T

APH-0328-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1128-T-T

APH-1128-T-T

APH-1128-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0726-T-R

APH-0726-T-R

APH-0726-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1228-T-T

APH-1228-T-T

APH-1228-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0326-T-R

APH-0326-T-R

APH-0326-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0228-T-T

APH-0228-T-T

APH-0228-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1826-T-R

APH-1826-T-R

APH-1826-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1328-T-T

APH-1328-T-T

APH-1328-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1726-T-R

APH-1726-T-R

APH-1726-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
121-13-210-41-001000

121-13-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
121-13-210-41-001000

데이터시트

121 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-91-119-41-005000

317-91-119-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
RFQ
317-91-119-41-005000

데이터시트

317 Bulk Active SIP 19 (1 x 19) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-642-41-001000

110-91-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
110-91-642-41-001000

데이터시트

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-642-41-001000

110-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-41-642-41-001000

데이터시트

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-3575-10

28-3575-10

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

0 -
RFQ
28-3575-10

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-6575-10

28-6575-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

0 -
RFQ
28-6575-10

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
117-47-628-41-005000

117-47-628-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
117-47-628-41-005000

데이터시트

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-0508-20

40-0508-20

CONN SOCKET SIP 40POS GOLD

Aries Electronics

0 -
RFQ
40-0508-20

데이터시트

508 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
40-0508-30

40-0508-30

CONN SOCKET SIP 40POS GOLD

Aries Electronics

0 -
RFQ
40-0508-30

데이터시트

508 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
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