IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
146-41-316-41-012000

146-41-316-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
146-41-316-41-012000

데이터시트

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-91-316-41-012000

146-91-316-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
146-91-316-41-012000

데이터시트

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-87-650-41-013101

116-87-650-41-013101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
116-87-650-41-013101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-240-16-001101

510-83-240-16-001101

CONN SOCKET PGA 240POS GOLD

Preci-Dip

0 -
RFQ
510-83-240-16-001101

데이터시트

510 Bulk Active PGA 240 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-240-17-061101

510-83-240-17-061101

CONN SOCKET PGA 240POS GOLD

Preci-Dip

0 -
RFQ
510-83-240-17-061101

데이터시트

510 Bulk Active PGA 240 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
111-93-420-41-001000

111-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
111-93-420-41-001000

데이터시트

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-43-420-41-001000

111-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
111-43-420-41-001000

데이터시트

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
232-1271-00-1102JH

232-1271-00-1102JH

OEM LCC SOCKETS 32 POS SOLID LID

3M

0 -
RFQ
232-1271-00-1102JH

데이터시트

OEM - Obsolete - - - - - - - - - - - - - - -
317-43-112-41-005000

317-43-112-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

0 -
RFQ
317-43-112-41-005000

데이터시트

317 Bulk Active SIP 12 (1 x 12) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-140-31-018000

714-43-140-31-018000

CONN SOCKET SIP 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
714-43-140-31-018000

데이터시트

714 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-318-G-A

APA-318-G-A

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-318-G-A

데이터시트

APA Bulk Active - 18 (2 x 9) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
210-43-424-41-001000

210-43-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
210-43-424-41-001000

데이터시트

210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-93-424-41-001000

210-93-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
210-93-424-41-001000

데이터시트

210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-47-316-41-005000

117-47-316-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
117-47-316-41-005000

데이터시트

117 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
18-822-90E

18-822-90E

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0 -
RFQ
18-822-90E

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
110-41-628-41-605000

110-41-628-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-41-628-41-605000

데이터시트

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-628-41-605000

110-91-628-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-91-628-41-605000

데이터시트

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-310-41-001000

116-93-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-310-41-001000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-310-41-001000

116-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-310-41-001000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-11-210-41-780000

104-11-210-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
104-11-210-41-780000

데이터시트

104 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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