IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1606-G-H

APH-1606-G-H

APH-1606-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1206-G-H

APH-1206-G-H

APH-1206-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0406-G-H

APH-0406-G-H

APH-0406-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1706-G-H

APH-1706-G-H

APH-1706-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1806-G-H

APH-1806-G-H

APH-1806-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0706-G-H

APH-0706-G-H

APH-0706-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
HLS-0215-G-10

HLS-0215-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0215-G-10

데이터시트

HLS Tube Active SIP 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
18-6810-90

18-6810-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
RFQ
18-6810-90

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
22-81150-610C

22-81150-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
RFQ
22-81150-610C

데이터시트

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-81250-310C

22-81250-310C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
RFQ
22-81250-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-81250-610C

22-81250-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
RFQ
22-81250-610C

데이터시트

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-8500-610C

22-8500-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
RFQ
22-8500-610C

데이터시트

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-8600-610C

22-8600-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
RFQ
22-8600-610C

데이터시트

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-8850-610C

22-8850-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
RFQ
22-8850-610C

데이터시트

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
605-93-310-11-480000

605-93-310-11-480000

SOCKET CARRIER LOWPRO .300 10POS

Mill-Max Manufacturing Corp.

0 -
RFQ
605-93-310-11-480000

데이터시트

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-43-310-11-480000

605-43-310-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
RFQ
605-43-310-11-480000

데이터시트

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-428-41-001000

110-91-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
110-91-428-41-001000

데이터시트

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-428-41-001000

110-41-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-41-428-41-001000

데이터시트

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-310-41-008000

116-93-310-41-008000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-310-41-008000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-93-310-41-001000

126-93-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
126-93-310-41-001000

데이터시트

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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