IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
18-1508-31

18-1508-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
RFQ
18-1508-31

데이터시트

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
614-93-306-41-001000

614-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
614-93-306-41-001000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-306-41-001000

614-43-306-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-43-306-41-001000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0210-G-12

HLS-0210-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0210-G-12

데이터시트

HLS Tube Active SIP 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
210-44-628-41-001000

210-44-628-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
RFQ
210-44-628-41-001000

데이터시트

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-648-T-M

APA-648-T-M

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-648-T-M

데이터시트

APA Tube Active - 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-0618-T-H

APH-0618-T-H

APH-0618-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1318-T-H

APH-1318-T-H

APH-1318-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0818-T-H

APH-0818-T-H

APH-0818-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
110-91-322-41-001000

110-91-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
110-91-322-41-001000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-422-41-001000

110-91-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
110-91-422-41-001000

데이터시트

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-322-41-001000

110-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-41-322-41-001000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-422-41-001000

110-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-41-422-41-001000

데이터시트

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-41-320-41-001000

115-41-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
115-41-320-41-001000

데이터시트

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-41-420-41-001000

115-41-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
115-41-420-41-001000

데이터시트

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-91-320-41-001000

115-91-320-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
RFQ
115-91-320-41-001000

데이터시트

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-91-420-41-001000

115-91-420-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
RFQ
115-91-420-41-001000

데이터시트

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-41-316-41-001000

115-41-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
115-41-316-41-001000

데이터시트

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-91-316-41-001000

115-91-316-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
RFQ
115-91-316-41-001000

데이터시트

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-47-322-41-001000

115-47-322-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
RFQ
115-47-322-41-001000

데이터시트

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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