IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1122-T-R

APH-1122-T-R

APH-1122-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1622-T-R

APH-1622-T-R

APH-1622-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0722-T-R

APH-0722-T-R

APH-0722-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0322-T-R

APH-0322-T-R

APH-0322-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1322-T-R

APH-1322-T-R

APH-1322-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1222-T-R

APH-1222-T-R

APH-1222-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0422-T-R

APH-0422-T-R

APH-0422-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
110-47-424-41-001000

110-47-424-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-47-424-41-001000

데이터시트

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0217-T-15

HLS-0217-T-15

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0217-T-15

데이터시트

HLS Tube Active SIP 34 (2 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-83-223-18-002101

510-83-223-18-002101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
RFQ
510-83-223-18-002101

데이터시트

510 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-223-18-091101

510-83-223-18-091101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
RFQ
510-83-223-18-091101

데이터시트

510 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-223-18-092101

510-83-223-18-092101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
RFQ
510-83-223-18-092101

데이터시트

510 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-223-18-093101

510-83-223-18-093101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
RFQ
510-83-223-18-093101

데이터시트

510 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-223-18-094101

510-83-223-18-094101

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
RFQ
510-83-223-18-094101

데이터시트

510 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-47-310-41-007000

116-47-310-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
RFQ
116-47-310-41-007000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-93-210-41-117000

114-93-210-41-117000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
114-93-210-41-117000

데이터시트

114 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-322-41-001000

110-47-322-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-47-322-41-001000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-314-41-605000

110-41-314-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-41-314-41-605000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-314-41-605000

110-91-314-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-91-314-41-605000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-91-108-41-005000

317-91-108-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
RFQ
317-91-108-41-005000

데이터시트

317 Bulk Active SIP 8 (1 x 8) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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