IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
21-0501-20

21-0501-20

CONN SOCKET SIP 21POS TIN

Aries Electronics

0 -
RFQ
21-0501-20

데이터시트

501 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
21-0501-30

21-0501-30

CONN SOCKET SIP 21POS TIN

Aries Electronics

0 -
RFQ
21-0501-30

데이터시트

501 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
114-47-306-41-117000

114-47-306-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
RFQ
114-47-306-41-117000

데이터시트

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0211-G-38

HLS-0211-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0211-G-38

데이터시트

HLS Tube Active SIP 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICO-324-ZNGG

ICO-324-ZNGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-324-ZNGG

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
115-47-310-41-001000

115-47-310-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
RFQ
115-47-310-41-001000

데이터시트

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
14-8490-310C

14-8490-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-8490-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-8910-310C

14-8910-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-8910-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
111-41-306-41-001000

111-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
111-41-306-41-001000

데이터시트

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-91-306-41-001000

111-91-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
111-91-306-41-001000

데이터시트

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-640-KGT

ICO-640-KGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-640-KGT

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-640-KGT

ICA-640-KGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-640-KGT

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-83-196-14-000101

510-83-196-14-000101

CONN SOCKET PGA 196POS GOLD

Preci-Dip

0 -
RFQ
510-83-196-14-000101

데이터시트

510 Bulk Active PGA 196 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-93-304-61-105000

110-93-304-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-99-308-41-001000

210-99-308-41-001000

CONN IC DIP SOCKET 8POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
RFQ
210-99-308-41-001000

데이터시트

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-44-308-41-001000

210-44-308-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
RFQ
210-44-308-41-001000

데이터시트

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
16-0508-21

16-0508-21

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
RFQ
16-0508-21

데이터시트

508 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
16-0508-31

16-0508-31

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
RFQ
16-0508-31

데이터시트

508 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
ICA-648-ZSGT

ICA-648-ZSGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-648-ZSGT

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0120-G-10

HLS-0120-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0120-G-10

데이터시트

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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