IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1614-T-R

APH-1614-T-R

APH-1614-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0908-G-T

APH-0908-G-T

APH-0908-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1214-T-R

APH-1214-T-R

APH-1214-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0814-T-R

APH-0814-T-R

APH-0814-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0708-G-T

APH-0708-G-T

APH-0708-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
16-810-90

16-810-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
RFQ
16-810-90

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
13-7450-10

13-7450-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

0 -
RFQ
13-7450-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
13-7970-10

13-7970-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

0 -
RFQ
13-7970-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
38-3513-11

38-3513-11

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
RFQ
38-3513-11

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
15-0503-21

15-0503-21

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
RFQ
15-0503-21

데이터시트

0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
15-0503-31

15-0503-31

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
RFQ
15-0503-31

데이터시트

0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
22-0508-20

22-0508-20

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
RFQ
22-0508-20

데이터시트

508 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
22-0508-30

22-0508-30

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
RFQ
22-0508-30

데이터시트

508 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
22-1508-30

22-1508-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
RFQ
22-1508-30

데이터시트

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
510-83-181-17-001101

510-83-181-17-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
RFQ
510-83-181-17-001101

데이터시트

510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-181-17-082101

510-83-181-17-082101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
RFQ
510-83-181-17-082101

데이터시트

510 Bulk Active PGA 181 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-181-14-031101

510-83-181-14-031101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
RFQ
510-83-181-14-031101

데이터시트

510 Bulk Active PGA 181 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-181-15-001101

510-83-181-15-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
RFQ
510-83-181-15-001101

데이터시트

510 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-0501-20

18-0501-20

CONN SOCKET SIP 18POS TIN

Aries Electronics

0 -
RFQ
18-0501-20

데이터시트

501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-0501-30

18-0501-30

CONN SOCKET SIP 18POS TIN

Aries Electronics

0 -
RFQ
18-0501-30

데이터시트

501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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