IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
ICO-632-ZMGT

ICO-632-ZMGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-632-ZMGT

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-83-172-16-001101

510-83-172-16-001101

CONN SOCKET PGA 172POS GOLD

Preci-Dip

0 -
RFQ
510-83-172-16-001101

데이터시트

510 Bulk Active PGA 172 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-156-15-061101

510-83-156-15-061101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

0 -
RFQ
510-83-156-15-061101

데이터시트

510 Bulk Active PGA 156 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-156-15-062101

510-83-156-15-062101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

0 -
RFQ
510-83-156-15-062101

데이터시트

510 Bulk Active PGA 156 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0218-T-22

HLS-0218-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0218-T-22

데이터시트

HLS Tube Active SIP 36 (2 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
14-0508-21

14-0508-21

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
RFQ
14-0508-21

데이터시트

508 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
14-0508-31

14-0508-31

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
RFQ
14-0508-31

데이터시트

508 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
27-0508-20

27-0508-20

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
RFQ
27-0508-20

데이터시트

508 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
27-0508-30

27-0508-30

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
RFQ
27-0508-30

데이터시트

508 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
20-3508-201

20-3508-201

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-3508-201

데이터시트

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-3508-301

20-3508-301

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-3508-301

데이터시트

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
21-0508-30

21-0508-30

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
RFQ
21-0508-30

데이터시트

508 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
APO-624-T-R

APO-624-T-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-624-T-R

데이터시트

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-324-T-R

APO-324-T-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-324-T-R

데이터시트

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
24-3503-20

24-3503-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-3503-20

데이터시트

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-1508-21

14-1508-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-1508-21

데이터시트

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
14-1508-31

14-1508-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-1508-31

데이터시트

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
116-83-650-41-011101

116-83-650-41-011101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
116-83-650-41-011101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
11-0501-20

11-0501-20

CONN SOCKET SIP 11POS TIN

Aries Electronics

0 -
RFQ
11-0501-20

데이터시트

501 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
11-0501-30

11-0501-30

CONN SOCKET SIP 11POS TIN

Aries Electronics

0 -
RFQ
11-0501-30

데이터시트

501 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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