IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
26-1508-30

26-1508-30

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
RFQ
26-1508-30

데이터시트

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
APA-640-T-A1

APA-640-T-A1

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-640-T-A1

데이터시트

APA Bulk Active - 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
PGA168H004B1-1706R

PGA168H004B1-1706R

PGA SOCKET 168 CTS

Amphenol ICC (FCI)

0 -
RFQ
PGA168H004B1-1706R

데이터시트

- - Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
123-13-628-41-001000

123-13-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
123-13-628-41-001000

데이터시트

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-640-ZSST

ICO-640-ZSST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-640-ZSST

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-640-ZSST

ICA-640-ZSST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-640-ZSST

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-320-ZMGG

ICO-320-ZMGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-320-ZMGG

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
16-0501-20

16-0501-20

CONN SOCKET SIP 16POS TIN

Aries Electronics

0 -
RFQ
16-0501-20

데이터시트

501 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-0501-30

16-0501-30

CONN SOCKET SIP 16POS TIN

Aries Electronics

0 -
RFQ
16-0501-30

데이터시트

501 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
346-93-134-41-013000

346-93-134-41-013000

CONN SOCKET SIP 34POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
346-93-134-41-013000

데이터시트

346 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-134-41-013000

346-43-134-41-013000

CONN SOCKET SIP 34POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
346-43-134-41-013000

데이터시트

346 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
05-7380-10

05-7380-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
RFQ
05-7380-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-83-648-41-011101

116-83-648-41-011101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
RFQ
116-83-648-41-011101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APO-318-T-H

APO-318-T-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-318-T-H

데이터시트

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-1504-G-R

APH-1504-G-R

APH-1504-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0604-G-R

APH-0604-G-R

APH-0604-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1104-G-R

APH-1104-G-R

APH-1104-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1204-G-R

APH-1204-G-R

APH-1204-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1804-G-R

APH-1804-G-R

APH-1804-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
510-87-289-17-000101

510-87-289-17-000101

CONN SOCKET PGA 289POS GOLD

Preci-Dip

0 -
RFQ
510-87-289-17-000101

데이터시트

510 Bulk Active PGA 289 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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