IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
ICA-640-SGT

ICA-640-SGT

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.

15 -
RFQ
ICA-640-SGT

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
115-93-306-41-001000

115-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

133 -
RFQ
115-93-306-41-001000

데이터시트

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-310-41-105000

110-93-310-41-105000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

1,148 -
RFQ
110-93-310-41-105000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-210-41-105000

110-43-210-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

154 -
RFQ
110-43-210-41-105000

데이터시트

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-314-41-105000

110-43-314-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

161 -
RFQ
110-43-314-41-105000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-316-41-105000

110-43-316-41-105000

SOCKET IC .300 16POS SMD

Mill-Max Manufacturing Corp.

173 -
RFQ
110-43-316-41-105000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-310-41-001000

110-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

956 -
RFQ
110-13-310-41-001000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-13-640-41-001000

210-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,135 -
RFQ
210-13-640-41-001000

데이터시트

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-324-11-001000

299-43-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

176 -
RFQ
299-43-324-11-001000

데이터시트

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-2397198-1

1-2397198-1

SOCKET 4710 FOR ODM

TE Connectivity AMP Connectors

0 -
RFQ

-

- Tray Active LGA 4710 0.031" (0.80mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount - Solder 0.031" (0.80mm) Tin - Copper Alloy Thermoplastic -40°C ~ 100°C
1674770-7

1674770-7

HARD TRAY ASSY MPGA479M W/TAPE

TE Connectivity AMP Connectors

6,240 -
RFQ
1674770-7

데이터시트

- Bulk Active PGA, ZIF (ZIP) 479 (26 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
1-390263-1

1-390263-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
1-390263-1

데이터시트

- Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
2-641296-4

2-641296-4

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-641296-4

데이터시트

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
2-382462-3

2-382462-3

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
2-382462-3

데이터시트

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic -55°C ~ 105°C
1-390262-1

1-390262-1

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
1-390262-1

데이터시트

- Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze - -40°C ~ 105°C
2-382568-0

2-382568-0

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
2-382568-0

데이터시트

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
02-0518-10

02-0518-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

12,441 -
RFQ
02-0518-10

데이터시트

518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
2-382465-3

2-382465-3

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
2-382465-3

데이터시트

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic -55°C ~ 105°C
346-43-101-41-013000

346-43-101-41-013000

CONN SOCKET SIP 1POS GOLD

Mill-Max Manufacturing Corp.

1,753 -
RFQ
346-43-101-41-013000

데이터시트

346 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
211-1-06-003

211-1-06-003

CONN IC DIP SOCKET 6POS GOLD

CNC Tech

7,352 -
RFQ
211-1-06-003

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
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