IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-0610-T-H

APH-0610-T-H

APH-0610-T-H

Samtec Inc.

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RFQ

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APH-1110-T-H

APH-1110-T-H

APH-1110-T-H

Samtec Inc.

0 -
RFQ

-

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APH-0210-T-H

APH-0210-T-H

APH-0210-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0310-T-H

APH-0310-T-H

APH-0310-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1610-T-H

APH-1610-T-H

APH-1610-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0910-T-H

APH-0910-T-H

APH-0910-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1210-T-H

APH-1210-T-H

APH-1210-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1410-T-H

APH-1410-T-H

APH-1410-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0710-T-H

APH-0710-T-H

APH-0710-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1710-T-H

APH-1710-T-H

APH-1710-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1310-T-H

APH-1310-T-H

APH-1310-T-H

Samtec Inc.

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RFQ

-

* - Active - - - - - - - - - - - - - - -
3-1437504-6

3-1437504-6

CONN TRANSIST TO-3 3POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
3-1437504-6

데이터시트

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Gold 50.0µin (1.27µm) Beryllium Copper Chassis Mount Closed Frame Solder - Gold 50.0µin (1.27µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
123-43-632-41-001000

123-43-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
123-43-632-41-001000

데이터시트

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
35-0511-10

35-0511-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

0 -
RFQ
35-0511-10

데이터시트

511 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-7350-10

05-7350-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
RFQ
05-7350-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-7500-10

05-7500-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
RFQ
05-7500-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-7560-10

05-7560-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
RFQ
05-7560-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-7650-10

05-7650-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
RFQ
05-7650-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-7880-10

05-7880-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
RFQ
05-7880-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
33-0518-11H

33-0518-11H

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
RFQ
33-0518-11H

데이터시트

518 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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