IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
22-6501-20

22-6501-20

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

0 -
RFQ
22-6501-20

데이터시트

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-6501-30

22-6501-30

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

0 -
RFQ
22-6501-30

데이터시트

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
09-0501-20

09-0501-20

CONN SOCKET SIP 9POS TIN

Aries Electronics

0 -
RFQ
09-0501-20

데이터시트

501 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
33-0511-10

33-0511-10

CONN SOCKET SIP 33POS TIN

Aries Electronics

0 -
RFQ
33-0511-10

데이터시트

511 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
824-AG30D

824-AG30D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
824-AG30D

데이터시트

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
14-823-90C

14-823-90C

IC SOCKET 14PIN VERT SCKT HORIZ

Aries Electronics

0 -
RFQ

-

Vertisockets™ 800 - Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-3518-01

16-3518-01

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
RFQ
16-3518-01

데이터시트

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
16-6823-90T

16-6823-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

0 -
RFQ
16-6823-90T

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
16-822-90T

16-822-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

0 -
RFQ
16-822-90T

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
14-4820-90C

14-4820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-4820-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-4823-90C

14-4823-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-4823-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-6820-90C

14-6820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-6820-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-6822-90C

14-6822-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-6822-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-6823-90C

14-6823-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-6823-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-820-90C

14-820-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-820-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-822-90C

14-822-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-822-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-422-WGT-2

ICA-422-WGT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-422-WGT-2

데이터시트

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
32-1518-11H

32-1518-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
RFQ
32-1518-11H

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICF-640-TM-O

ICF-640-TM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-640-TM-O

데이터시트

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
HLS-0120-T-11

HLS-0120-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0120-T-11

데이터시트

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
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