IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
44-1518-10T

44-1518-10T

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

0 -
RFQ
44-1518-10T

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICA-314-ZWGT

ICA-314-ZWGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-314-ZWGT

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
614-93-624-31-012000

614-93-624-31-012000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
614-93-624-31-012000

데이터시트

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-43-428-41-005000

117-43-428-41-005000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
117-43-428-41-005000

데이터시트

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0308-S-2

HLS-0308-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0308-S-2

데이터시트

HLS Tube Active SIP 24 (3 x 8) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
HLS-0108-G-18

HLS-0108-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0108-G-18

데이터시트

HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICA-316-WGT-3

ICA-316-WGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-316-WGT-3

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0208-T-10

HLS-0208-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0208-T-10

데이터시트

HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-87-650-41-012101

116-87-650-41-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
116-87-650-41-012101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-648-31-012101

614-83-648-31-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
RFQ
614-83-648-31-012101

데이터시트

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-640-STT-L

ICA-640-STT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-640-STT-L

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
2-1437542-7

2-1437542-7

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-1437542-7

데이터시트

700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
116-87-636-41-001101

116-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
RFQ
116-87-636-41-001101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-3518-101H

18-3518-101H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
RFQ
18-3518-101H

데이터시트

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICA-308-ZWGG-3

ICA-308-ZWGG-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-308-ZWGG-3

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0205-G-10

HLS-0205-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0205-G-10

데이터시트

HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICF-632-TL-O

ICF-632-TL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-632-TL-O

데이터시트

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
116-83-632-41-001101

116-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
116-83-632-41-001101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
346-93-117-41-013000

346-93-117-41-013000

CONN SOCKET SIP 17POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
346-93-117-41-013000

데이터시트

346 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-117-41-013000

346-43-117-41-013000

CONN SOCKET SIP 17POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
346-43-117-41-013000

데이터시트

346 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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