IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-0702-G-H

APH-0702-G-H

APH-0702-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
ICO-324-LTT

ICO-324-LTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-324-LTT

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICO-624-LTT

ICO-624-LTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-624-LTT

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
116-83-428-41-001101

116-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
116-83-428-41-001101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-314-T-M

APA-314-T-M

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-314-T-M

데이터시트

APA Tube Active - 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
832-AG11D

832-AG11D

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
832-AG11D

데이터시트

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
123-87-640-41-001101

123-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
RFQ
123-87-640-41-001101

데이터시트

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-628-ZSTT

ICO-628-ZSTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-628-ZSTT

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
12-6513-10H

12-6513-10H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
RFQ
12-6513-10H

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
146-83-432-41-036101

146-83-432-41-036101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
146-83-432-41-036101

데이터시트

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-632-41-035101

146-83-632-41-035101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
146-83-632-41-035101

데이터시트

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-632-41-036101

146-83-632-41-036101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
146-83-632-41-036101

데이터시트

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-318-WTT-2

ICA-318-WTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-318-WTT-2

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
346-93-114-41-013000

346-93-114-41-013000

CONN SOCKET SIP 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
346-93-114-41-013000

데이터시트

346 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-114-41-013000

346-43-114-41-013000

CONN SOCKET SIP 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
346-43-114-41-013000

데이터시트

346 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
212-1-32-006

212-1-32-006

CONN IC DIP SOCKET 32POS GOLD

CNC Tech

0 -
RFQ
212-1-32-006

데이터시트

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
510-87-132-13-001101

510-87-132-13-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

0 -
RFQ
510-87-132-13-001101

데이터시트

510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-132-13-002101

510-87-132-13-002101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

0 -
RFQ
510-87-132-13-002101

데이터시트

510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-132-13-041101

510-87-132-13-041101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

0 -
RFQ
510-87-132-13-041101

데이터시트

510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-132-13-042101

510-87-132-13-042101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

0 -
RFQ
510-87-132-13-042101

데이터시트

510 Bulk Active PGA 132 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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