IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1302-T-H

APH-1302-T-H

APH-1302-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
614-83-324-31-012101

614-83-324-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
614-83-324-31-012101

데이터시트

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-424-31-012101

614-83-424-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
614-83-424-31-012101

데이터시트

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-066-11-002101

510-87-066-11-002101

CONN SOCKET PGA 66POS GOLD

Preci-Dip

0 -
RFQ
510-87-066-11-002101

데이터시트

510 Bulk Active PGA 66 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
14-0513-11

14-0513-11

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
RFQ
14-0513-11

데이터시트

0513 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
16-0513-10H

16-0513-10H

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
RFQ
16-0513-10H

데이터시트

0513 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
22-0513-10

22-0513-10

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
RFQ
22-0513-10

데이터시트

0513 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0106-T-11

HLS-0106-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0106-T-11

데이터시트

HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
115-87-650-41-001101

115-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-424-41-008101

116-87-424-41-008101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-87-424-41-008101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-318-41-009101

116-83-318-41-009101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
RFQ
116-83-318-41-009101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-320-41-007101

116-83-320-41-007101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
116-83-320-41-007101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-424-41-018101

116-83-424-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-83-424-41-018101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1825532-1

1825532-1

CONN SOCKET SIP 16POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1825532-1

데이터시트

510 - Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Thermoplastic, Polyester -
510-87-075-11-001101

510-87-075-11-001101

CONN SOCKET PGA 75POS GOLD

Preci-Dip

0 -
RFQ
510-87-075-11-001101

데이터시트

510 Bulk Active PGA 75 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-3503-20

06-3503-20

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-3503-20

데이터시트

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
06-3503-30

06-3503-30

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-3503-30

데이터시트

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
06-3518-01

06-3518-01

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-3518-01

데이터시트

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0204-T-10

HLS-0204-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0204-T-10

데이터시트

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
299-83-210-10-001101

299-83-210-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
299-83-210-10-001101

데이터시트

299 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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