IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
AR 52-HZL/01-TT

AR 52-HZL/01-TT

SOCKET

Assmann WSW Components

0 -
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
BU220Z-178-HT

BU220Z-178-HT

CONN IC DIP SOCKET 22POS GOLD

On Shore Technology Inc.

0 -
RFQ
BU220Z-178-HT

데이터시트

BU-178HT Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
AR 64-HZL-TT

AR 64-HZL-TT

CONN IC DIP SOCKET 64POS TIN

Assmann WSW Components

0 -
RFQ
AR 64-HZL-TT

데이터시트

- Tray Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
ICF-314-TM-O

ICF-314-TM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-314-TM-O

데이터시트

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-314-T-I

ICF-314-T-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-314-T-I

데이터시트

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
4620

4620

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

0 -
RFQ
4620

데이터시트

- Bulk Obsolete Transistor, TO-3 3 (Rectangular) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
540-44-044-24-000000

540-44-044-24-000000

CONN SOCKET PLCC 44POS TIN

Mill-Max Manufacturing Corp.

0 -
RFQ
540-44-044-24-000000

데이터시트

540 Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
06-6513-10H

06-6513-10H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-6513-10H

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
11-0513-11

11-0513-11

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
RFQ
11-0513-11

데이터시트

0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
23-0518-10T

23-0518-10T

CONN SOCKET SIP 23POS GOLD

Aries Electronics

0 -
RFQ
23-0518-10T

데이터시트

518 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
212-1-16-003

212-1-16-003

CONN IC DIP SOCKET 16POS GOLD

CNC Tech

0 -
RFQ
212-1-16-003

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
HLS-0114-TT-2

HLS-0114-TT-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0114-TT-2

데이터시트

HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
614-87-432-41-001101

614-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
614-87-432-41-001101

데이터시트

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-87-310-11-001101

299-87-310-11-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
299-87-310-11-001101

데이터시트

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-328-41-001101

115-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-87-320-41-001101

122-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
122-87-320-41-001101

데이터시트

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-87-422-41-001101

123-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ
123-87-422-41-001101

데이터시트

123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APO-314-T-J

APO-314-T-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-314-T-J

데이터시트

APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
D0818-01

D0818-01

CONN IC DIP SOCKET 18POS GOLD

Harwin Inc.

0 -
RFQ
D0818-01

데이터시트

D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SMPX-68LCC-P

SMPX-68LCC-P

SMT PLCC SOCKET 68P POLARISED RO

Kycon, Inc.

0 -
RFQ
SMPX-68LCC-P

데이터시트

SMPX Tube Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
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