IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
116-87-424-41-003101

116-87-424-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-87-424-41-003101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
16-3511-10WR

16-3511-10WR

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

0 -
RFQ
16-3511-10WR

데이터시트

511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
SIP050-1X25-160B

SIP050-1X25-160B

1X25-160B-SIP SOCKET 25 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X25-160B

데이터시트

SIP050-1x Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
121-83-316-41-001101

121-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
121-83-316-41-001101

데이터시트

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X32-157B

SIP050-1X32-157B

1X32-157B-SIP SOCKET 32 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X32-157B

데이터시트

SIP050-1x Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
116-87-318-41-009101

116-87-318-41-009101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
RFQ
116-87-318-41-009101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
C8114-04

C8114-04

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

0 -
RFQ
C8114-04

데이터시트

Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-4513-10H

08-4513-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
RFQ
08-4513-10H

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-2513-11

10-2513-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
RFQ
10-2513-11

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
17-0513-10

17-0513-10

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
RFQ
17-0513-10

데이터시트

0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
22-0518-10T

22-0518-10T

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
RFQ
22-0518-10T

데이터시트

518 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-0518-10

24-0518-10

CONN SOCKET SIP 24POS GOLD

Aries Electronics

0 -
RFQ
24-0518-10

데이터시트

518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-83-320-41-105161

110-83-320-41-105161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
110-83-320-41-105161

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-624-41-005101

117-83-624-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
117-83-624-41-005101

데이터시트

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 50-HZL/01-TT

AR 50-HZL/01-TT

SOCKET

Assmann WSW Components

0 -
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
ICA-308-ZSST

ICA-308-ZSST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-308-ZSST

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
124-83-312-41-002101

124-83-312-41-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ

-

124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-0513-11

08-0513-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
RFQ
08-0513-11

데이터시트

0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-314-41-009101

116-83-314-41-009101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
116-83-314-41-009101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-420-41-001101

612-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
612-83-420-41-001101

데이터시트

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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