IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
814-AG11D

814-AG11D

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
814-AG11D

데이터시트

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
20-3540-10

20-3540-10

COLLET PIN CARRIER 20-PIN .300

Aries Electronics

0 -
RFQ

-

- - Obsolete - - - - - - - - - - - - - - -
116-87-324-41-018101

116-87-324-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-87-324-41-018101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-318-41-007101

116-87-318-41-007101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
RFQ
116-87-318-41-007101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-318-41-006101

116-83-318-41-006101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
RFQ
116-83-318-41-006101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-316-41-009101

116-87-316-41-009101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
116-87-316-41-009101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
07-0513-11

07-0513-11

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
RFQ
07-0513-11

데이터시트

0513 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
7-1437539-0

7-1437539-0

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
7-1437539-0

데이터시트

800 Tube Obsolete DIP, 0.5 to 0.6" Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
116-87-424-41-006101

116-87-424-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-87-424-41-006101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 48-HZL/01-TT

AR 48-HZL/01-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

0 -
RFQ
AR 48-HZL/01-TT

데이터시트

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
1571540-1

1571540-1

CONN SOCKET PLCC 32POS TIN

TE Connectivity AMP Connectors

0 -
RFQ

-

- Bulk Obsolete PLCC 32 (2 x 7, 2 x 9) 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS) -
15-0513-10

15-0513-10

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
RFQ
15-0513-10

데이터시트

0513 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-4518-10T

20-4518-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-4518-10T

데이터시트

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
18-0518-10H

18-0518-10H

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
RFQ
18-0518-10H

데이터시트

518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
18-1518-10H

18-1518-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
RFQ
18-1518-10H

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
614-87-624-41-001101

614-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
614-87-624-41-001101

데이터시트

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-640-41-605101

110-87-640-41-605101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
RFQ
110-87-640-41-605101

데이터시트

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-640-41-005101

110-87-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
RFQ
110-87-640-41-005101

데이터시트

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-044-12-071101

510-87-044-12-071101

CONN SOCKET PGA 44POS GOLD

Preci-Dip

0 -
RFQ
510-87-044-12-071101

데이터시트

510 Bulk Active PGA 44 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-324-41-001101

115-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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