IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
ICA-308-ZSTT

ICA-308-ZSTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-308-ZSTT

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
300-014-000

300-014-000

CONN SOCKET SIP 14POS GOLD

3M

0 -
RFQ

-

300 - Obsolete SIP 14 (1 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
13-0513-10

13-0513-10

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
RFQ
13-0513-10

데이터시트

0513 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
16-0518-10

16-0518-10

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
RFQ
16-0518-10

데이터시트

518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
05-0517-90C

05-0517-90C

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
RFQ
05-0517-90C

데이터시트

0517 Bulk Active SIP 5 (1 x 5) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-83-210-41-001101

116-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-83-210-41-001101

데이터시트

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-310-41-001101

116-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-83-310-41-001101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-99-052-24-000000

540-99-052-24-000000

CONN SOCKET PLCC 52POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
RFQ
540-99-052-24-000000

데이터시트

540 Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
299-83-306-11-001101

299-83-306-11-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
299-83-306-11-001101

데이터시트

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP640-001B

DIP640-001B

DIP640-001B-DIP SOCKET 40 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP640-001B

데이터시트

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
HLS-0103-G-31

HLS-0103-G-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0103-G-31

데이터시트

HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
115-87-628-41-003101

115-87-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
115-87-628-41-003101

데이터시트

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X19-160B

SIP050-1X19-160B

1X19-160B-SIP SOCKET 19 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X19-160B

데이터시트

SIP050-1x Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
116-87-310-41-004101

116-87-310-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-310-41-004101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
10-0513-10

10-0513-10

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
RFQ
10-0513-10

데이터시트

0513 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
18-3518-10T

18-3518-10T

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
RFQ
18-3518-10T

데이터시트

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0106-T-2

HLS-0106-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0106-T-2

데이터시트

HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
2-916783-5

2-916783-5

CONN SOCKET PGA ZIF 370POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-916783-5

데이터시트

- Tray Obsolete PGA, ZIF (ZIP) 370 (19 x 19) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
10-0513-11

10-0513-11

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
RFQ
10-0513-11

데이터시트

0513 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
17-0518-10T

17-0518-10T

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
RFQ
17-0518-10T

데이터시트

518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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