IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
123-83-308-41-001101

123-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,414 -
RFQ
123-83-308-41-001101

데이터시트

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
8420-21B1-RK-TP

8420-21B1-RK-TP

CONN SOCKET PLCC 20POS TIN

3M

3,538 -
RFQ
8420-21B1-RK-TP

데이터시트

8400 Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
20-3518-10

20-3518-10

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

511 -
RFQ
20-3518-10

데이터시트

518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-3518-11

08-3518-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

225 -
RFQ
08-3518-11

데이터시트

518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
A-CCS 052-Z-T

A-CCS 052-Z-T

IC SOCKET PLCC 52POS TIN

Assmann WSW Components

1,119 -
RFQ
A-CCS 052-Z-T

데이터시트

- Tube Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
110-41-314-41-001000

110-41-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

810 -
RFQ
110-41-314-41-001000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
D2899-42

D2899-42

CONN IC DIP SOCKET 3POS GOLD

Harwin Inc.

773 -
RFQ
D2899-42

데이터시트

D2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 3 (1 x 3), 2 Loaded 0.200" (5.08mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.200" (5.08mm) Tin 196.9µin (5.00µm) Brass Polyamide (PA), Nylon, Glass Filled -55°C ~ 125°C
8428-21B1-RK-TP

8428-21B1-RK-TP

CONN SOCKET PLCC 28POS TIN

3M

2,470 -
RFQ
8428-21B1-RK-TP

데이터시트

8400 Tube Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8428-11B1-RK-TP

8428-11B1-RK-TP

CONN SOCKET PLCC 28POS TIN

3M

862 -
RFQ
8428-11B1-RK-TP

데이터시트

8400 Tube Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-44-624-41-001000

110-44-624-41-001000

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.

2,598 -
RFQ
110-44-624-41-001000

데이터시트

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-324-41-001000

110-44-324-41-001000

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.

900 -
RFQ
110-44-324-41-001000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
SA286000

SA286000

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

593 -
RFQ
SA286000

데이터시트

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
D2820-42

D2820-42

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

8,261 -
RFQ
D2820-42

데이터시트

D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
18-3518-10

18-3518-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

391 -
RFQ
18-3518-10

데이터시트

518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICM-648-1-GT-HT

ICM-648-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 48P

Adam Tech

729 -
RFQ
ICM-648-1-GT-HT

데이터시트

ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
110-87-324-41-001101

110-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,421 -
RFQ
110-87-324-41-001101

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
8432-11B1-RK-TP

8432-11B1-RK-TP

CONN SOCKET PLCC 32POS TIN

3M

627 -
RFQ
8432-11B1-RK-TP

데이터시트

8400 Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR 32-HZL/01-TT

AR 32-HZL/01-TT

CONN IC DIP SOCKET 32POS GOLD

Assmann WSW Components

1,868 -
RFQ
AR 32-HZL/01-TT

데이터시트

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
PLCC-68-AT-SMT

PLCC-68-AT-SMT

CONN SOCKET PLCC 68POS PHOS BRNZ

Adam Tech

1,421 -
RFQ
PLCC-68-AT-SMT

데이터시트

PLCC Tube Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
110-47-624-41-001000

110-47-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

291 -
RFQ
110-47-624-41-001000

데이터시트

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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