IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
612-87-320-41-001101

612-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
612-87-320-41-001101

데이터시트

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
BU160Z-178-HT

BU160Z-178-HT

CONN IC DIP SOCKET 16POS GOLD

On Shore Technology Inc.

0 -
RFQ
BU160Z-178-HT

데이터시트

BU-178HT Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
116-83-210-41-003101

116-83-210-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-83-210-41-003101

데이터시트

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-88-044-17-400-TR

540-88-044-17-400-TR

CONN SOCKET PLCC 44POS TIN

Preci-Dip

0 -
RFQ
540-88-044-17-400-TR

데이터시트

540 Tape & Reel (TR) Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
116-87-314-41-012101

116-87-314-41-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
116-87-314-41-012101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 18-HZW/TN

AR 18-HZW/TN

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

0 -
RFQ
AR 18-HZW/TN

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR20-HZW/T

AR20-HZW/T

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

0 -
RFQ

-

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
HLS-0104-T-10

HLS-0104-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0104-T-10

데이터시트

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-83-308-41-001101

116-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-83-308-41-001101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0103-G-22

HLS-0103-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0103-G-22

데이터시트

HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ED068PLCZ

ED068PLCZ

CONN SOCKET PLCC 68POS TIN

On Shore Technology Inc.

0 -
RFQ
ED068PLCZ

데이터시트

ED Tube Active PLCC 68 (2 x 34) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
06-0513-10H

06-0513-10H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
RFQ
06-0513-10H

데이터시트

0513 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
117-87-428-41-005101

117-87-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
117-87-428-41-005101

데이터시트

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-610-41-009101

116-87-610-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-610-41-009101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-210-41-008101

116-83-210-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-83-210-41-008101

데이터시트

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-310-41-008101

116-83-310-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-83-310-41-008101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0202-T-30

HLS-0202-T-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0202-T-30

데이터시트

HLS Tube Active SIP 4 (2 x 2) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-87-036-06-000101

510-87-036-06-000101

CONN SOCKET PGA 36POS GOLD

Preci-Dip

0 -
RFQ
510-87-036-06-000101

데이터시트

510 Bulk Active PGA 36 (6 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-310-41-035101

146-83-310-41-035101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
146-83-310-41-035101

데이터시트

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-310-41-036101

146-83-310-41-036101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
146-83-310-41-036101

데이터시트

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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