IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
D01-9950642

D01-9950642

CONN SOCKET SIP 6POS GOLD

Harwin Inc.

0 -
RFQ
D01-9950642

데이터시트

D01-995 Tube Obsolete SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-312-41-003101

116-87-312-41-003101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ
116-87-312-41-003101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-310-41-001101

614-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
614-83-310-41-001101

데이터시트

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0102-G-10

HLS-0102-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0102-G-10

데이터시트

HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
07-0518-11

07-0518-11

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
RFQ
07-0518-11

데이터시트

518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
123-87-310-41-001101

123-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
123-87-310-41-001101

데이터시트

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
4-382568-0

4-382568-0

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
4-382568-0

데이터시트

Diplomate DL Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
612-87-314-41-001101

612-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
612-87-314-41-001101

데이터시트

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-306-41-004101

116-87-306-41-004101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
116-87-306-41-004101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-610-41-001101

614-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
614-83-610-41-001101

데이터시트

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SMPX-20LCC-N-TR

SMPX-20LCC-N-TR

SMT PLCC 20P NON POLARISED, T&R

Kycon, Inc.

0 -
RFQ
SMPX-20LCC-N-TR

데이터시트

SMPX Tape & Reel (TR) Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
116-83-306-41-009101

116-83-306-41-009101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
116-83-306-41-009101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-318-41-117101

114-87-318-41-117101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
RFQ
114-87-318-41-117101

데이터시트

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D00-044-490-001

D00-044-490-001

CONN SOCKET PLCC 44POS TIN-LEAD

EDAC Inc.

0 -
RFQ
D00-044-490-001

데이터시트

D00 Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) - Surface Mount Closed Frame - - - - - - -
110-83-310-41-105101

110-83-310-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
110-83-310-41-105101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS044-Z-SM/T

A-CCS044-Z-SM/T

SOCKET

Assmann WSW Components

0 -
RFQ
A-CCS044-Z-SM/T

데이터시트

- Bulk Active PLCC 44 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
SIP050-1X14-157B

SIP050-1X14-157B

1X14-157B-SIP SOCKET 14 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X14-157B

데이터시트

SIP050-1x Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
03-0513-11H

03-0513-11H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
RFQ
03-0513-11H

데이터시트

0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-0513-10H

04-0513-10H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
RFQ
04-0513-10H

데이터시트

0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
01-0508-31

01-0508-31

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
RFQ
01-0508-31

데이터시트

508 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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