헤더, 수컷 핀

제조업체 시리즈 패키징 제품 상태 커넥터 유형 접점 유형 피치 - Mating 위치 수 행 수 행 간격 - Mating 로드된 위치 수 스타일 덮개 장착 유형 종단 고정 유형 접촉 길이 - Mating 접촉 길이 - 포스트 전체 접촉 길이 절연 높이 접촉 모양 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 마감 - 포스트 접점 재질 절연 재료 기능 작동 온도 전류 정격(암페어)

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 커넥터 유형 접점 유형 피치 - Mating 위치 수 행 수 행 간격 - Mating 로드된 위치 수 스타일 덮개 장착 유형 종단 고정 유형 접촉 길이 - Mating 접촉 길이 - 포스트 전체 접촉 길이 절연 높이 접촉 모양 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 마감 - 포스트 접점 재질 절연 재료 기능 작동 온도 전류 정격(암페어)
SLV W 7 092 32 Z

SLV W 7 092 32 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 092 32 Z

데이터시트

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 32 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 7 092 36 G

SLV W 7 092 36 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 092 36 G

데이터시트

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 36 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 117 30 Z

SLV W 8 117 30 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 117 30 Z

데이터시트

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 30 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 117 26 Z

SLV W 8 117 26 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 117 26 Z

데이터시트

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 26 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 6 117 8 Z

SLV W 6 117 8 Z

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0 -
RFQ
SLV W 6 117 8 Z

데이터시트

SLV W 6 117 Bulk Active Header Male Pin 0.050" (1.27mm) 8 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 6 117 6 G

SLV W 6 117 6 G

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0 -
RFQ
SLV W 6 117 6 G

데이터시트

SLV W 6 117 Bulk Active Header Male Pin 0.050" (1.27mm) 6 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 092 6 G

SLV W 8 092 6 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 092 6 G

데이터시트

SLV W 8 092 Bulk Active Header Male Pin 0.050" (1.27mm) 6 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 7 092 44 Z

SLV W 7 092 44 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 092 44 Z

데이터시트

SLV W 7 092 Tube Active Header Male Pin 0.050" (1.27mm) 44 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 7 092 68 Z

SLV W 7 092 68 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 092 68 Z

데이터시트

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 68 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 092 32 G

SLV W 8 092 32 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 092 32 G

데이터시트

SLV W 8 092 Bulk Active Header Male Pin 0.050" (1.27mm) 32 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 092 54 G

SLV W 8 092 54 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 092 54 G

데이터시트

SLV W 8 092 Bulk Active Header Male Pin 0.050" (1.27mm) 54 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 1 081 10 G

SLY 1 081 10 G

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 081 10 G

데이터시트

SLY 1 081 Bulk Active Header Male Pin 0.079" (2.00mm) 10 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.118" (3.00mm) 0.319" (8.10mm) 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 4 KA 060 50 Z

SLV W 4 KA 060 50 Z

GRID 1.27 X1.27 MM; SUITABLE FO

Fischer Elektronik

0 -
RFQ
SLV W 4 KA 060 50 Z

데이터시트

SLV W 4 KA 060 Bulk Active Header Male Pin 0.050" (1.27mm) 50 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 6 117 25 Z

SLV W 6 117 25 Z

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0 -
RFQ
SLV W 6 117 25 Z

데이터시트

SLV W 6 117 Bulk Active Header Male Pin 0.050" (1.27mm) 25 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 4 KA 060 48 G

SLV W 4 KA 060 48 G

GRID 1.27 X1.27 MM; SUITABLE FO

Fischer Elektronik

0 -
RFQ
SLV W 4 KA 060 48 G

데이터시트

SLV W 4 KA 060 Bulk Active Header Male Pin 0.050" (1.27mm) 48 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 6 092 28 G

SLV W 6 092 28 G

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0 -
RFQ
SLV W 6 092 28 G

데이터시트

SLV W 6 092 Bulk Active Header Male Pin 0.050" (1.27mm) 28 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 6 117 10 G

SLV W 6 117 10 G

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0 -
RFQ
SLV W 6 117 10 G

데이터시트

SLV W 6 117 Bulk Active Header Male Pin 0.050" (1.27mm) 10 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 1 104 7 Z

SLY 1 104 7 Z

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 104 7 Z

데이터시트

SLY 1 104 Bulk Active Header Male Pin 0.079" (2.00mm) 7 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.232" (5.90mm) 0.118" (3.00mm) 0.409" (10.40mm) 0.059" (1.50mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 11 SMD 133 34 G

SLY 11 SMD 133 34 G

ONE ROW, 0.5 MM, SUITABLE FOR

Fischer Elektronik

0 -
RFQ
SLY 11 SMD 133 34 G

데이터시트

SLY 11 SMD 133 Tube Active Header Male Pin 0.079" (2.00mm) 34 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.142" (3.60mm) - - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 11 SMD 051 30 S

SLY 11 SMD 051 30 S

ONE ROW, 0.5 MM, SUITABLE FOR

Fischer Elektronik

0 -
RFQ
SLY 11 SMD 051 30 S

데이터시트

SLY 11 SMD 051 Bulk Active Header Male Pin 0.079" (2.00mm) 30 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.142" (3.60mm) - - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
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