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| 사진 | 제조사 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | 시리즈 | 패키징 | 제품 상태 | 커넥터 유형 | 접점 유형 | 피치 - Mating | 위치 수 | 행 수 | 행 간격 - Mating | 로드된 위치 수 | 스타일 | 덮개 | 장착 유형 | 종단 | 고정 유형 | 접촉 길이 - Mating | 접촉 길이 - 포스트 | 전체 접촉 길이 | 절연 높이 | 접촉 모양 | 접촉 마감 - 결합 | 접촉 마감 두께 - Mating | 접촉 마감 - 포스트 | 접점 재질 | 절연 재료 | 기능 | 작동 온도 | 전류 정격(암페어) |
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MTSW-106-09-L-S-430-RACONN HEADER R/A 6POS 2.54MM |
0 | - |
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데이터시트 |
Flex Stack, MTSW | Bulk | Active | Header, Cuttable | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.430" (10.92mm) | 0.090" (2.29mm) | - | 0.119" (3.02mm) | Square | Gold | 10.0µin (0.25µm) | Tin | Phosphor Bronze | Polyester, Glass Filled | - | -55°C ~ 125°C | 3A |
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HTSW-105-08-S-S-LACONN HEADER VERT 5POS 2.54MM |
0 | - |
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- |
HTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 5 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Kinked Pin, Solder | Push-Pull | 0.230" (5.84mm) | 0.090" (2.29mm) | - | 0.122" (3.10mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | Varies by Wire Gauge |
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MTMS-102-54-G-D-326CONN HDR .050" 4POS |
0 | - |
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데이터시트 |
Flex Stack, MTMS | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 4 | 2 | 0.100" (2.54mm) | All | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.326" (8.28mm) | 0.129" (3.28mm) | 0.555" (14.10mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - |
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HTMS-102-54-G-DCONN HDR .050" 20POS |
0 | - |
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- |
HTMS | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 4 | 2 | 0.100" (2.54mm) | All | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.335" (8.51mm) | 0.120" (3.05mm) | 0.555" (14.10mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 5A per Contact |
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HMTSW-108-23-L-S-230CONN HEADER VERT 8POS 2.54MM |
0 | - |
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데이터시트 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 8 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.115" (2.92mm) | 0.445" (11.30mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3A |
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TMS-104-21-G-S.050" (1.27MM) MICRO HEADER |
0 | - |
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- |
TMS | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 4 | 1 | - | All | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.175" (4.45mm) | 0.505" (12.83mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 5A per Contact |
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TMS-104-51-S-S.050" (1.27MM) MICRO HEADER |
0 | - |
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- |
TMS | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 4 | 1 | - | All | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.190" (4.83mm) | 0.120" (3.05mm) | 0.410" (10.41mm) | 0.100" (2.54mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 5A per Contact |
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FTR-102-01-G-DCONN HEADER SMD 4POS 1.27MM |
0 | - |
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데이터시트 |
FTR | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 4 | 2 | 0.100" (2.54mm) | All | Board to Board | Unshrouded | Surface Mount | Solder | Push-Pull | 0.230" (5.84mm) | - | - | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 3.1A per Contact |
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TSW-103-30-G-S-RA-001CONN HEADER R/A 3POS 2.54MM |
0 | - |
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- |
TSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 3 | 1 | - | 2 | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.320" (8.13mm) | 0.600" (15.24mm) | - | 0.119" (3.02mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | -55°C ~ 125°C | - |
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HTSW-106-06-S-SCONN HEADER VERT 6POS 2.54MM |
0 | - |
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- |
HTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.105" (2.67mm) | 0.095" (2.41mm) | 0.300" (7.62mm) | 0.100" (2.54mm) | Square | Gold | 30.0µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | Varies by Wire Gauge |
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HTSW-106-08-F-DCONN HEADER VERT 12POS 2.54MM |
0 | - |
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데이터시트 |
HTSW | Bag | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.200" (5.08mm) | 0.530" (13.46mm) | 0.100" (2.54mm) | Square | Gold | 3.00µin (0.076µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | Varies by Wire Gauge |
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HTSW-106-16-G-S-LLCONN HEADER VERT 6POS 2.54MM |
0 | - |
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- |
HTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Kinked Pin, Solder | Push-Pull | 0.320" (8.13mm) | 0.310" (7.87mm) | 0.730" (18.54mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | Varies by Wire Gauge |
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MTSW-203-12-F-S-730-RACONN HEADER R/A 3POS 5.08MM |
0 | - |
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데이터시트 |
Flex Stack, MTSW | Bulk | Active | Header, Cuttable | Male Pin | 0.200" (5.08mm) | 3 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.730" (18.54mm) | 0.090" (2.29mm) | - | 0.119" (3.02mm) | Square | Gold | 3.00µin (0.076µm) | Tin | Phosphor Bronze | Polyester, Glass Filled | - | -55°C ~ 125°C | 3A |
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TMS-103-01-G-S-002.050" (1.27MM) MICRO HEADER |
0 | - |
|
데이터시트 |
TMS | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 3 | 1 | - | 2 | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.450" (11.43mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | 5A per Contact |
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HPM-02-04-T-S-RA.200" POWER TERMINAL STRIP |
0 | - |
|
데이터시트 |
HPM | Bulk | Active | Header | Male Pin | 0.200" (5.08mm) | 2 | 1 | - | All | Board to Board | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Square | Tin | - | Tin | Copper Alloy | Polybutylene Terephthalate (PBT) | - | -55°C ~ 105°C | - |
|
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HTMS-102-01-G-D-SMCONN HDR .050" 20POS |
0 | - |
|
데이터시트 |
HTMS | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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MTMS-104-25-L-S-125CONN HDR .050" 4POS |
0 | - |
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- |
Flex Stack, MTMS | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 4 | 1 | - | All | Board to Board | Unshrouded | Through Hole | Solder | Push-Pull | 0.125" (3.18mm) | 0.105" (2.67mm) | 0.330" (8.38mm) | 0.100" (2.54mm) | Square | Gold | 10.0µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - |
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1-827745-6CONN HEADER VERT 16POS 2.54MM |
174 | - |
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데이터시트 |
AMP-Latch | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 16 | 2 | 0.100" (2.54mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole | Solder | - | - | - | - | - | - | Gold or Gold-Palladium | 31.5µin (0.80µm) | - | - | - | Keying Slot, Mounting Flange | - | - |
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HMTSW-113-07-T-S-110CONN HEADER VERT 13POS 2.54MM |
0 | - |
|
데이터시트 |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 13 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.110" (2.79mm) | 0.220" (5.58mm) | 0.430" (10.92mm) | 0.100" (2.54mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 105°C | 3A |
|
5041940570CONN HEADER SMD 5POS 1.25MM |
107 | - |
|
데이터시트 |
Micro-Lock 504194 | Tape & Reel (TR) | Active | Header | Male Blade | 0.049" (1.25mm) | 5 | 1 | - | All | Board to Cable/Wire | Shrouded - 4 Wall | Surface Mount | Solder | Latch Lock | - | - | - | 0.163" (4.15mm) | Rectangular | Tin | 39.4µin (1.00µm) | Tin | Brass | Polyamide (PA), Nylon, Glass Filled | Solder Retention | - | - |
