IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
2-210735-5

2-210735-5

CONN SOCKET SIP 25POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
RFQ

-

- Bulk Obsolete SIP 25 (1 x 25) 0.100" (2.54mm) Tin-Lead - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead - - Thermoplastic -
8080-1G45

8080-1G45

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

0 -
RFQ

-

8060 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin - Beryllium Copper Chassis Mount Closed Frame Solder - Tin - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
820-AG10D-ES

820-AG10D-ES

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
820-AG10D-ES

데이터시트

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
5-1437542-2

5-1437542-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
5-1437542-2

데이터시트

700 - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
643647-6

643647-6

CONN SOCKET SIP 15POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
643647-6

데이터시트

Diplomate DL Tray Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
9-1437530-4

9-1437530-4

CONN SOCKET SIP 11POS

TE Connectivity AMP Connectors

0 -
RFQ
9-1437530-4

데이터시트

500 Bulk Obsolete SIP 11 (1 x 11) 0.100" (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) - - Beryllium Copper Thermoplastic -
824-AG32D

824-AG32D

CONN IC DIP SOCKET 24POS TINLEAD

TE Connectivity AMP Connectors

0 -
RFQ
824-AG32D

데이터시트

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
1-390261-5

1-390261-5

CONN IC DIP SOCKET 18POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
1-390261-5

데이터시트

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
8080-1G17

8080-1G17

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
8080-1G17

데이터시트

8060 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin - Beryllium Copper Chassis Mount Closed Frame Solder - Tin - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
8080-1G25

8080-1G25

CONN TRANSIST TO-3 3POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
8080-1G25

데이터시트

8060 Bulk Obsolete Transistor, TO-3 3 (Oval) - Gold - Beryllium Copper Chassis Mount Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
8059-2G8

8059-2G8

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ

-

8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
1825094-4

1825094-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1825094-4

데이터시트

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
1825109-3

1825109-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ

-

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
1825276-2

1825276-2

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1825276-2

데이터시트

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
2-821949-4

2-821949-4

CONN SOCKET PQFP 100POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
RFQ
2-821949-4

데이터시트

- Tube Obsolete QFP 100 (4 x 25) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
SIP1X06-014BLF

SIP1X06-014BLF

CONN SOCKET SIP 6POS TIN

Amphenol ICC (FCI)

0 -
RFQ
SIP1X06-014BLF

데이터시트

SIP1x Bulk Obsolete SIP 6 (1 x 6) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X05-014BLF

SIP1X05-014BLF

CONN SOCKET SIP 5POS TIN

Amphenol ICC (FCI)

0 -
RFQ
SIP1X05-014BLF

데이터시트

SIP1x Bulk Obsolete SIP 5 (1 x 5) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X08-011BLF

SIP1X08-011BLF

CONN SOCKET SIP 8POS GOLD

Amphenol ICC (FCI)

0 -
RFQ
SIP1X08-011BLF

데이터시트

SIP1x Bulk Obsolete SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X07-014BLF

SIP1X07-014BLF

CONN SOCKET SIP 7POS TIN

Amphenol ICC (FCI)

0 -
RFQ
SIP1X07-014BLF

데이터시트

SIP1x Bulk Obsolete SIP 7 (1 x 7) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X06-011BLF

SIP1X06-011BLF

CONN SOCKET SIP 6POS GOLD

Amphenol ICC (FCI)

0 -
RFQ
SIP1X06-011BLF

데이터시트

SIP1x Bulk Obsolete SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
Total 19086 Record«Prev1... 924925926927928929930931...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자