IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
299-PRS20009-12

299-PRS20009-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
299-PRS20009-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
225-PRS15001-16

225-PRS15001-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
225-PRS15001-16

데이터시트

PRS Bulk Obsolete PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 200°C
1023-2-0324-0B-01

1023-2-0324-0B-01

TEXTOOLTEST & BURN-IN BALL GRID

3M

0 -
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
256-5205-01

256-5205-01

3M TEXTOOL 256-5205-01 QFN .5 MM

3M

0 -
RFQ

-

Textool™ Bulk Active - - - - - - - - - - - - - - -
268-4204-00

268-4204-00

3M TEXTOOL 268-4204-00 QFN.4 MM

3M

0 -
RFQ

-

Textool™ Bulk Active - - - - - - - - - - - - - - -
216-PLS21016-12

216-PLS21016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
216-PLS21016-12

데이터시트

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
7100236450

7100236450

TEXTOOLTEST & BURN-IN BALL GRID

3M

0 -
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
36-3574-18

36-3574-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0 -
RFQ
36-3574-18

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6574-18

36-6574-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0 -
RFQ
36-6574-18

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6575-18

36-6575-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0 -
RFQ
36-6575-18

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
336-PRS21022-12

336-PRS21022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
336-PRS21022-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
281-PLS19012-12

281-PLS19012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
281-PLS19012-12

데이터시트

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
240-PRS20014-12

240-PRS20014-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
240-PRS20014-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
40-3574-18

40-3574-18

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

0 -
RFQ
40-3574-18

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-6574-18

40-6574-18

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
RFQ
40-6574-18

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
273-PRS21004-12

273-PRS21004-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
273-PRS21004-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
7100265147

7100265147

TEXTOOLBURN-IN GRID ZIP SOCKETS

3M

0 -
RFQ

-

Textool™ Bulk Active PGA, ZIF (ZIP) 132 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
256-PRS20005-12

256-PRS20005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
256-PRS20005-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
257-PLS20013-12

257-PLS20013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
257-PLS20013-12

데이터시트

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
257-PRS20013-12

257-PRS20013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
257-PRS20013-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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