IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
7100286975

7100286975

TEXTOOLBURN-IN GRID ZIP SOCKETS

3M

0 -
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
162-PLS20020-12

162-PLS20020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
162-PLS20020-12

데이터시트

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
162-PRS20020-12

162-PRS20020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
162-PRS20020-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
558-10-652M35-001104

558-10-652M35-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
RFQ
558-10-652M35-001104

데이터시트

558 Bulk Active BGA 652 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
164-PRS21013-12

164-PRS21013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
164-PRS21013-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
518-77-652M35-001105

518-77-652M35-001105

CONN SOCKET PGA 652POS GOLD

Preci-Dip

0 -
RFQ
518-77-652M35-001105

데이터시트

518 Bulk Active PGA 652 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
1019-2-0324-0B-01

1019-2-0324-0B-01

TEXTOOLTEST & BURN-IN BALL GRID

3M

0 -
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
168-PRS17011-12

168-PRS17011-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
168-PRS17011-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
172-PRS16002-12

172-PRS16002-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
172-PRS16002-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
225-PLS18003-12

225-PLS18003-12

ZIF PGA SOCKET 225 PIN 18 X 18

Aries Electronics

0 -
RFQ

-

PLS - Active PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
518-77-652M35-001106

518-77-652M35-001106

CONN SOCKET PGA 652POS GOLD

Preci-Dip

0 -
RFQ
518-77-652M35-001106

데이터시트

518 Bulk Active PGA 652 (35 x 35) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
289-PLS17001-12

289-PLS17001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
289-PLS17001-12

데이터시트

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
260-5204-01

260-5204-01

CONN SOCKET QFN 60POS GOLD

3M

0 -
RFQ
260-5204-01

데이터시트

Textool™ Bulk Active QFN 60 (4 x 15) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020" (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES) -
175-PRS16005-12

175-PRS16005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
175-PRS16005-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
28-3552-18

28-3552-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
28-3553-18

28-3553-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
28-6551-18

28-6551-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
28-6552-18

28-6552-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
28-6553-18

28-6553-18

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-3554-18

28-3554-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
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