IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
518-77-432M31-001105

518-77-432M31-001105

CONN SOCKET PGA 432POS GOLD

Preci-Dip

0 -
RFQ
518-77-432M31-001105

데이터시트

518 Bulk Active PGA 432 (31 x 31) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
68-536-11

68-536-11

CONN SOCKET PLCC ZIF 68POS GOLD

Aries Electronics

0 -
RFQ

-

536 - Obsolete PLCC, ZIF (ZIP) 68 (4 x 17) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
36-3571-16

36-3571-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0 -
RFQ
36-3571-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
36-3572-16

36-3572-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0 -
RFQ
36-3572-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
36-3573-16

36-3573-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0 -
RFQ
36-3573-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
36-3574-16

36-3574-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0 -
RFQ
36-3574-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-3575-16

36-3575-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0 -
RFQ
36-3575-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6571-16

36-6571-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0 -
RFQ
36-6571-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
36-6573-16

36-6573-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0 -
RFQ
36-6573-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6574-16

36-6574-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0 -
RFQ
36-6574-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6575-16

36-6575-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0 -
RFQ
36-6575-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
514-83-520M31-001148

514-83-520M31-001148

CONN SOCKET BGA 520POS GOLD

Preci-Dip

0 -
RFQ
514-83-520M31-001148

데이터시트

514 Bulk Active BGA 520 (31 x 31) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
101-PRS13022-12

101-PRS13022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
101-PRS13022-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
101-PRS13023-12

101-PRS13023-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
101-PRS13023-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
HLS-1717-T-22

HLS-1717-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-1717-T-22

데이터시트

HLS Bulk Active SIP 289 (17 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
30-PLS16017-12

30-PLS16017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
30-PLS16017-12

데이터시트

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
30-PLS16018-12

30-PLS16018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
30-PLS16018-12

데이터시트

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
30-PLS16020-12

30-PLS16020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
30-PLS16020-12

데이터시트

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
30-PLS16022-12

30-PLS16022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
30-PLS16022-12

데이터시트

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
30-PRS16017-12

30-PRS16017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
30-PRS16017-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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