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| 사진 | 제조사 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | 시리즈 | 패키징 | 제품 상태 | 유형 | 위치 또는 핀 수(그리드) | 피치 - Mating | 접촉 마감 - 결합 | 접촉 마감 두께 - Mating | 접촉 재료 - Mating | 장착 유형 | 기능 | 종단 | 피치 - 포스트 | 접촉 마감 - 포스트 | 접촉 마감 두께 - 포스트 | 접촉 재료 - 포스트 | 하우징 소재 | 작동 온도 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
69-PLS11031-12CONN SOCKET PGA ZIF GOLD |
0 | - |
|
데이터시트 |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
69-PLS13112-12CONN SOCKET PGA ZIF GOLD |
0 | - |
|
데이터시트 |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
69-PRS11031-12CONN SOCKET PGA ZIF GOLD |
0 | - |
|
데이터시트 |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
69-PRS11055-12CONN SOCKET PGA ZIF GOLD |
0 | - |
|
데이터시트 |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
69-PRS13112-12CONN SOCKET PGA ZIF GOLD |
0 | - |
|
데이터시트 |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
518-77-400M20-000106CONN SOCKET PGA 400POS GOLD |
0 | - |
|
데이터시트 |
518 | Bulk | Active | PGA | 400 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
20-PLS13120-12CONN SOCKET PGA ZIF GOLD |
0 | - |
|
데이터시트 |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
20-PRS13120-12CONN SOCKET PGA ZIF GOLD |
0 | - |
|
데이터시트 |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
36-3553-16CONN IC DIP SOCKET ZIF 36POS |
0 | - |
|
데이터시트 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
36-6551-16CONN IC DIP SOCKET ZIF 36POS |
0 | - |
|
데이터시트 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
36-6552-16CONN IC DIP SOCKET ZIF 36POS |
0 | - |
|
데이터시트 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
36-6553-16CONN IC DIP SOCKET ZIF 36POS |
0 | - |
|
데이터시트 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
|
36-3552-16CONN IC DIP SOCKET ZIF 36POS |
0 | - |
|
데이터시트 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
36-3554-16CONN IC DIP SOCKET ZIF 36POS |
0 | - |
|
데이터시트 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
36-6554-16CONN IC DIP SOCKET ZIF 36POS |
0 | - |
|
데이터시트 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
550-80-361-18-101135PGA SOLDER TAIL |
0 | - |
|
데이터시트 |
550 | Bulk | Active | PGA | 361 (18 x 18) | 0.050" (1.27mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
192-PGM17043-10HCONN SOCKET PGA GOLD |
0 | - |
|
데이터시트 |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
44-6556-41CONN IC DIP SOCKET 44POS GOLD |
0 | - |
|
데이터시트 |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 44 (2 x 22) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
546-83-545-17-000147CONN SOCKET PGA 545POS GOLD |
0 | - |
|
데이터시트 |
546 | Bulk | Active | PGA | 545 (17 x 17) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
80-PRS13127-12CONN SOCKET PGA ZIF GOLD |
0 | - |
|
데이터시트 |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |

